Thin film capacitor

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United States of America Patent

PATENT NO 10755854
APP PUB NO 20190103220A1
SERIAL NO

16145231

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a thin film capacitor that includes: a first electrode layer having a principal surface in which a plurality of recesses are provided; a dielectric layer laminated on the principal surface of the first electrode layer; and a second electrode layer laminated on the dielectric layer. When a depth of the recess is defined as FL and a thickness of the dielectric layer is defined as T, H/T is 0.05 or more and 0.5 or less.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andoh, Suguru Tokyo, JP 4 12
Hiraoka, Masahiro Tokyo, JP 20 66
Matsutani, Atsuo Tokyo, JP 3 3
Saita, Hitoshi Tokyo, JP 52 172

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