Optical module having wiring and bridge substrates for modulation signals

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10802303
APP PUB NO 20190107739A1
SERIAL NO

16150327

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An optical module including a source assembly is disclosed. The source assembly provides a semiconductor optical device, a wiring substrate, and a bridge substrate. The semiconductor optical device includes an electrode and a pad that receives a driving signal therethrough. The wiring substrate, which is arranged side by side with respect to the semiconductor optical device, provides a signal line and a ground line surrounding the signal line. The bridge substrate includes a signal line and a ground line surrounding the signal line. A feature of the optical module is that the bridge substrate is placed on the semiconductor optical device and the wiring substrate such that a transmission line thereof faces the semiconductor optical device and the wiring substrate, and one end of the signal line thereof is connected with the pad of the semiconductor optical device through a post, and another end of the signal line thereof is connected with an end of the signal line in the wiring substrate through another post.

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Patent Owner(s)

  • SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.; SUMITOMO ELECTRIC INDUSTRIES LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimura, Yasushi Osaka, JP 74 713
Misawa, Taichi Osaka, JP 12 6
Yamaji, Kazuhiro Yokohama, JP 24 142

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