Connection Arrangement

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20190128331A1
SERIAL NO

16094418

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Connection arrangement between a shaft and a bore, wherein the connection can be produced via a pressing operation and a subsequent soldering operation. An object on which the invention is based is to improve a connection arrangement in such a manner that sufficient wetting of the components with solder is provided even in unfavorable circumstances in terms of fit and that, before the soldering operation, the connection between the pressed-in shaft and bore has at least one gap. The circumferential length of the at least one gap and/or the sum of all the circumferential lengths of the gaps is less than the circumferential length of the bore. The resulting gaps have a gap width between 0.05 and 0.2 mm, preferably 0.1 mm. With these gap widths, it is possible to achieve a particularly good flow of solder during soldering.

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Patent Owner(s)

Patent OwnerAddress
CONTITECH TECHNO-CHEMIE GMBH61184 KARBEN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zahradnik, Stefan Schotten-Michelbach, DE 1 1

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