Composition for etching and manufacturing method of semiconductor device using the same

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United States of America Patent

PATENT NO 11912902
APP PUB NO 20190136090A1
SERIAL NO

16228780

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Abstract

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The present invention relates to a composition for etching, comprising a first inorganic acid, a first additive represented by Chemical Formula 1, and a solvent.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jin-Uk Seongnam-si, KR 29 144
Lim, Jung-Hun Seongnam-si, KR 15 53
Park, Jae-Wan Seongnam-si, KR 32 188

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