Aliphatic UV cured polyurethane optical endpoint detection windows with high UV transparency for CMP polishing pads

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United States of America Patent

PATENT NO 10465097
APP PUB NO 20190144713A1
SERIAL NO

15815121

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Abstract

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The present invention provides chemical mechanical (CMP) polishing pads for polishing a substrate chosen from a semiconductor substrate comprising the CMP polishing pad and having one or more endpoint detection windows which is the cured product of a reaction mixture of a linear cycloaliphatic urethane macromonomer having two (meth)acrylate endgroups bound via cycloaliphatic dicarbamate esters to a polyether, polycarbonate or polyester chain having an average molecular weight of from 450 to 2,000, or an cycloaliphatic urethane oligomer thereof, and an aliphatic initiator, wherein the total isocyanate content in the urethane macromonomer ranges from 3.3 to 10 wt. %, and, further wherein, the composition comprises less than 5 wt. % of unreacted (meth)acrylate monomer and is substantially free of unreacted isocyanate. Regardless of their hardness or lack thereof, the endpoint detection windows provide excellent durability when wet.

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Patent Owner(s)

Patent OwnerAddress
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gadinski, Matthew R Newark, US 18 6

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