Resistor with upper surface heat dissipation
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United States of America Patent
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Oct 8, 2019
Grant Date -
May 16, 2019
app pub date -
Nov 5, 2018
filing date -
Nov 10, 2017
priority date (Note) -
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Abstract
Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
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