METHOD FOR BONDING DISSIMILAR METALS TO EACH OTHER

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United States of America Patent

APP PUB NO 20190160576A1
SERIAL NO

16320862

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Abstract

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Provided is a method for bonding dissimilar metals to each other, the method comprising: dissimilar metal layer-forming steps (P2), (P3), (P4) for supplying, to form dissimilar metal layers; a second metal layer-forming step (P5) for supplying, on the surface of the dissimilar metal layers, a filler material formed of a second metal, and heating the filler material formed of the second metal to a temperature equal to or higher than a melting point of the second metal, to form a second metal layer formed of the second metal; and a second material-to-be-bonded welding step (P6) for welding a second material to be bonded that is formed of the second metal, onto the second metal layer.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDTOKYO 108-8215

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIYA, Yasuyuki Tokyo, JP 10 11
ISHII, Ken Tokyo, JP 65 402

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