Method for arranging a plurality of seed substrates on a carrier element and carrier element having seed substrates

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United States of America Patent

PATENT NO 10943826
APP PUB NO 20190214302A1
SERIAL NO

16335911

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Abstract

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A method for arranging a plurality of semiconductor seed substrates on a carrier element, in which for applying a semiconductor layer to the seed substrates, the seed substrates are arranged on the carrier element by integral bonding. A carrier element having integrally bonded seed substrates for coating with a semiconductor layer is also provided.

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Patent Owner(s)

Patent OwnerAddress
NEXWAFE GMBH79108 FREIBURG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Reber, Stefan Gundelfingen, DE 44 123
Schillinger, Kai Freiburg, DE 10 3

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