METAL ELECTRODEPOSITION CATHODE PLATE AND PRODUCTION METHOD THEREFOR

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United States of America Patent

APP PUB NO 20190233960A1
SERIAL NO

16317141

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a metal electrodeposition cathode plate, the non-conductive film of which is not susceptible to failure and which can be used repeatedly, and a production method therefor. This cathode plate comprises a metal plate on which multiple disc-shaped protrusions are disposed, and a non-conductive film formed on the non-protrusion flat areas of the metal plate. The minimum film thickness Y of the non-conductive film at positions between the centers of adjacent protrusions is the same or greater than the height X of the protrusions. It is preferred that the height X of the protrusions is 50 μm to 1000 μm.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO METAL MINING CO LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Hiroshi Niihama-shi, JP 902 9719
Matsuoka, Itsumi Niihama-shi, JP 16 14
Senba, Yusuke Niihama-shi, JP 9 1
Watanabe, Hiroto Niihama-shi, JP 57 427

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