Method and device for placing collection strips in films
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United States of America Patent
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Oct 6, 2020
Grant Date -
Aug 8, 2019
app pub date -
Oct 13, 2017
filing date -
Oct 14, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a method and a device for laying busbars (5, 31, 33) in films, in which a bundle of heating wires (32) and at least two busbars (5, 31, 33), each electrically contacting at least one subset of the heating wires (32), are applied to at least one base film (3, 14-17, 21-24, 30), wherein the busbars (5, 31, 33) are each guided by a guide unit (35) in the direction of a pressure roller (1) and are pressed by the pressure roller (1) in the direction of the base film (3, 14-17, 21-24, 30) and are cut by a cutting device (8), it is proposed that the busbars (5, 31, 33) are each cut before the pressure roller (1) in the supply direction.
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