Memory module, memory system having the same and arrangement method of a board
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United States of America Patent
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Apr 14, 2020
Grant Date -
Aug 22, 2019
app pub date -
Jul 31, 2018
filing date -
Feb 21, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A memory module includes a module board including a first and second data vias configured to transmit first and second data, respectively, through first and second data lines arranged adjacent to each other external to the module board, a plurality of layers including the first and second data vias passing therethrough, and a plurality of semiconductor memory devices arranged on at least one outer surface of the module board. The plurality of layers include first and second layers adjacent to each other. The module board includes a first data via wing extending from the first data via toward the second data via and not connected to the second data via in the first layer, and a seventh data via wing extending from the second data via toward the first data via and not connected to the first data via to overlap the first data via wing in the second layer.
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