MOLDED INTERCONNECT SUBSTRATE FOR A CABLE ASSEMBLY
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United States of America Patent
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Issued Date -
Sep 5, 2019
app pub date -
Mar 1, 2018
filing date -
Mar 1, 2018
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Published
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Abstract
An electrical device includes a molded interconnect substrate having a top surface and a bottom surface, the substrate having a mold component and a laser direct structuring component. A conductive circuit is formed along the top surface having one or more signal contacts and one or more ground contacts. The electrical device includes a communication cable having a differential pair of signal conductors and a grounding element. The communication cable has a cable jacket surrounding the signal conductors and the grounding element. Each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact, the wire-terminating end projecting beyond a jacket edge of the cable jacket.
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TE CONNECTIVITY SOLUTIONS GMBH | 8200 SCHAFFHAUSEN |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Dill,, III Gustaf Emil | Mechanicsburg, US | 1 | 2 |
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