MOLDED INTERCONNECT SUBSTRATE FOR A CABLE ASSEMBLY

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20190273342A1
SERIAL NO

15909367

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electrical device includes a molded interconnect substrate having a top surface and a bottom surface, the substrate having a mold component and a laser direct structuring component. A conductive circuit is formed along the top surface having one or more signal contacts and one or more ground contacts. The electrical device includes a communication cable having a differential pair of signal conductors and a grounding element. The communication cable has a cable jacket surrounding the signal conductors and the grounding element. Each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact, the wire-terminating end projecting beyond a jacket edge of the cable jacket.

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Patent Owner(s)

Patent OwnerAddress
TE CONNECTIVITY CORPORATION1050 WESTLAKES DRIVE BERWYN PA 19312

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dill,, III Gustaf Emil Mechanicsburg, US 1 0

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