Electronic system comprising a microelectromechanical system and a box encapsulating this microelectromechanical system
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United States of America Patent
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May 4, 2021
Grant Date -
Sep 12, 2019
app pub date -
Mar 5, 2019
filing date -
Mar 7, 2018
priority date (Note) -
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Abstract
The present invention relates to an electronic system comprising an electronic system comprising an electromechanical microsystem and a hermetic box encapsulating said microsystem. The box includes a fastening plane. The electromechanical microsystem includes a sensitive part and at least two beams connecting the sensitive part to the fastening plane. The beams are thermally coupled to the sensitive part and are electrically coupled to one another. The system further includes a thermal regulator of the electromechanical microsystem including an electrical circuit including at least two ends connected to the beams, and a circuit controller able to generate an electrical current in the electrical circuit to modify the temperature of the sensitive part.
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