Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and Contactors

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United States of America Patent

APP PUB NO 20190277910A1
SERIAL NO

16426459

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Devices and methods for multilayer packages, antenna array feeds, test interface units, connectors, contactors, and large format substrates.

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Patent Owner(s)

Patent OwnerAddress
CUBIC CORPCALIFORNIA USA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boryssenko, Anatoliy O Belchertown, US 7 69
Rollin, Jean Marc Chapel Hill, US 2 10
Thompson, Rick L Amherst, US 13 203
Vanhille, Kenneth Cary, US 15 236

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