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United States of America Patent
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Issued Date -
Sep 12, 2019
app pub date -
Mar 22, 2018
filing date -
Mar 9, 2018
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Abstract
The invention provides a method of preparing a metallization structure on a solar cell. The method includes patterning a first composition on a surface of a semiconductor substrate; and applying a second composition over the first composition. An area covered by the first composition is 5-95% of an area covered by the second composition. The semiconductor substrate is then subjected to firing conditions. The invention also provides a metallization structure formed using the method described herein.
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