SEMICONDUCTOR PACKAGE DEVICE
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United States of America Patent
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Issued Date -
Sep 12, 2019
app pub date -
Mar 6, 2018
filing date -
Mar 6, 2018
priority date (Note) -
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Abstract
A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate
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