SOLVENT-LESS METHOD TO MANUFACTURE THIN FILM DEVICES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20190283070A1
SERIAL NO

16297294

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Abstract

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A method of forming a thin film device includes coating a web with a multi-layer thin film; and applying a mechanical force to release the multi-layer thin film from the web. Additional methods of forming a thin film device are disclosed.

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Patent Owner(s)

Patent OwnerAddress
VIAVI SOLUTIONS INC6001 AMERICA CENTER DRIVE SAN JOSE CA 95002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ARGOITIA, Alberto Santa Rosa, US 61 1143
LIANG, Kangning Santa Rosa, US 28 131
SEYDEL, Johannes P Santa Rosa, US 3 0
ZIEBA, Jaroslaw Santa Rosa, US 13 374

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