Methods and apparatus for cleaning substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11103898
APP PUB NO 20190283090A1
SERIAL NO

16334703

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Abstract

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The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.

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Patent Owner(s)

  • ACM RESEARCH, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fufa Cupertino, US 30 810
Chen, Fuping Shanghai, CN 40 27
Jia, Zhaowei Shanghai, CN 31 41
Jin, Yinuo Shanghai, CN 20 16
Li, Xuejun Shanghai, CN 54 456
Wang, Hui Fremont, US 1013 7945
Wang, Jian Shanghai, CN 1690 15934
Wang, Jun Shanghai, CN 1967 16900
Wang, Xi Shanghai, CN 327 2879
Zhang, Xiaoyan Shanghai, CN 128 1047

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