APPARATUS AND METHOD FOR DISPENSING A VISCOUS ADHESIVE
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United States of America Patent
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Issued Date -
Sep 19, 2019
app pub date -
Mar 13, 2018
filing date -
Mar 13, 2018
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Abstract
An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.
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