APPARATUS AND METHOD FOR DISPENSING A VISCOUS ADHESIVE

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United States of America

APP PUB NO 20190289760A1
SERIAL NO

15919364

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Abstract

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An apparatus and a method for dispensing a viscous adhesive for attaching a semiconductor die onto a substrate are provided, where the method comprises the steps of dispensing a volume of viscous adhesive from a nozzle onto the substrate and moving the nozzle away from the substrate such that an adhesive tail is formed between the nozzle and the volume of viscous adhesive. The method further comprises the steps of capturing multiple images of the adhesive tail with an imaging device as the nozzle is moving away from the substrate with an imaging device; and thereafter detecting with the imaging device an instant when the adhesive tail breaks from the volume of viscous adhesive.

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Patent Owner(s)

Patent OwnerAddress
ASM TECHNOLOGY SINGAPORE PTE LTDSINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHENG, Chi Wah Hong Kong, HK 52 184
YAU, Wan Yin Hong Kong, HK 5 1

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