Pressure Control Strategies to Provide Uniform Treatment Streams in the Manufacture of Microelectronic Devices

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United States of America Patent

APP PUB NO 20190291144A1
SERIAL NO

16360624

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber. control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.

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Patent Owner(s)

Patent OwnerAddress
TEL FSI INC3455 LYMAN BOULEVARD CHASKA MN 55318

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanzlik, Edward Shorewood, US 1 0
Siefering, Kevin Victoria, US 5 81

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