Pressure Control Strategies to Provide Uniform Treatment Streams in the Manufacture of Microelectronic Devices
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United States of America Patent
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Sep 26, 2019
app pub date -
Mar 21, 2019
filing date -
Mar 22, 2018
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Abstract
The present invention provides techniques to more accurately control the process performance of treatments in which microelectronic substrates are treated by pressurized fluids that are sprayed onto the substrates in a vacuum process chamber. control strategies are used that adjust mass flow rate responsive to pressure readings in order to hold the pressure of a pressurized feed constant. In these embodiments, the mass flow rate will tend to vary in order to maintain pressure uniformity.
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