COMPOSITION FOR SURFACE TREATMENT, AND METHOD FOR SURFACE TREATMENT AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE USING THE SAME
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United States of America Patent
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Oct 3, 2019
app pub date -
Aug 28, 2017
filing date -
Sep 23, 2016
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To provide a means for suppressing the rate of dissolution of tungsten while sufficiently removing the impurities remaining on a surface of a polished object to be polished having a layer containing at least tungsten, and tetraethyl orthosilicate or silicon nitride. To provide a composition for surface treatment, which contains a polymer compound having a sulfonic acid (salt) group, at least one compound selected from an amino acid and a polyol, and a dispersing medium, and is used for treating a surface of a polished object to be polished having a layer containing at least tungsten, and tetraethyl orthosilicate or silicon nitride.
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