Conduction path
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United States of America Patent
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-
Jul 28, 2020
Grant Date -
Oct 3, 2019
app pub date -
Mar 18, 2019
filing date -
Mar 28, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a technique that improves the heat dissipation properties of a wire that is arranged in a conduction path. A conduction path has a wire, a routing member that is made of a metal and has a routing groove in which the wire is routed, a bracket that is made of a metal and has a first mounting portion that is mounted to the routing member and has a second mounting portion that is mounted to an electrical connection box, and a heat transfer member that is made of a synthetic resin having a higher heat conductivity than air and is arranged in the routing groove and interposed between the wire and the routing member, in a region that corresponds to a portion of the routing member to which the first mounting portion is mounted.
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