Reduced sugar wafer
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United States of America Patent
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Nov 29, 2022
Grant Date -
Oct 17, 2019
app pub date -
Jul 7, 2017
filing date -
Jul 8, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates a sugar reduced wafer composition comprising, 60-80 wt. % of flour, 10-23 wt. % of sucrose, 0.5-8.0 wt. %, preferably 0.5-5 wt. % of oil or fat and 5-20 wt. % of non-digestible fibers wherein the total amount of mono and disaccharides is 10-25 wt. %; all wt. % being in weight percentage of the composition dry mass. The invention also relates to a baked sugar reduced wafer such as a wafer cone or edible container made with this composition and a process for manufacturing the sugar reduced wafer.
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