Method of forming a leadless stack comprising multiple components
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United States of America Patent
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Sep 29, 2020
Grant Date -
Oct 17, 2019
app pub date -
Jun 28, 2019
filing date -
May 26, 2010
priority date (Note) -
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Abstract
A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.
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