ETCHING SOLUTION COMPOSITION
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United States of America Patent
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Issued Date -
Oct 24, 2019
app pub date -
May 9, 2018
filing date -
Jan 22, 2018
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Abstract
An etching solution composition of this disclosure contains hydrogen peroxide, an etching inhibitor, a chelating agent, an etching additive, fluorides, a stabilizer, and water. Etching uniformity is increased by adjusting a mass proportion of each component in the etching solution composition, so as to avoid loss of properties such as etching tapered angles, etching deviation, and etching straightness, thereby enhancing product quality.
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