RF capacitive coupled etch reactor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11742187
APP PUB NO 20190341231A1
SERIAL NO

16473775

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Abstract

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In a capacitive coupled etch reactor, in which the smaller electrode is predominantly etched, the surface of the larger electrode is increased by a body e.g. a plate, which is on the same electric potential as the larger electrode and which is immersed in the plasma space. A pattern of openings in which plasma may burn is provided in the body so as to control the distribution of the etching effect on a substrate placed on the smaller electrode.

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Patent Owner(s)

  • EVATEC AG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Weichart, Johannes Balzers, LI 5 12
Weichart, Jurgen Balzers, LI 28 166

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