METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20190350078A1
SERIAL NO

16475721

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A metal-ceramic bonded substrate is such that a heat dissipating face is formed in a spherical protruding form, because of which contact pressure with a thermally conductive grease when attaching a heat dissipating fin to the heat dissipating face is high, and high heat dissipation can be secured. Also, by an overflow portion communicating with a metal base portion formation portion being provided farther to an outer side than an external form of the metal-ceramic bonded substrate in an interior of a casting mold, an overflow portion residue is restricted by the casting mold when causing molten metal to solidify and cool, because of which warping deformation occurring because of a difference between linear expansion coefficients of a metal material and a ceramic material can be restricted, and a casting defect such as a running defect in a molten metal flowing process, cold shut, a ripple mark, can be restricted.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONTOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OYA, Daisuke Tokyo, JP 17 80
TANAKA, Keisuke Tokyo, JP 181 1869
WAKABAYASHI, Yuki Tokyo, JP 53 169

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