Film forming system, film forming method, and computer storage medium

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United States of America Patent

PATENT NO 10964606
APP PUB NO 20190355573A1
SERIAL NO

16481136

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A film forming system is to form an organic film on a substrate having a pattern formed on a surface thereof, includes: an organic film formation section configured to perform an organic film formation treatment on the substrate to form the organic film on the substrate; a film thickness measurement section configured to measure a film thickness of the organic film on the substrate; and an ultraviolet treatment section configured to perform an ultraviolet irradiation treatment on the organic film on the substrate to remove a surface of the organic film. In the film forming system, the organic film formation section, the film thickness measurement section, and the ultraviolet treatment section are disposed side by side in this order along a transfer direction of the substrate.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Masashi Koshi, JP 64 454
Shimura, Satoru Koshi, JP 34 537

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