CHEMICAL MECHANICAL POLISHING SLURRY AND CHEMICAL MECHANICAL POLISHING PROCESS USING THE SAME
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United States of America
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May 24, 2018
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May 24, 2018
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The present disclosure provides a chemical mechanical polishing (CMP) slurry including a Lewis acid which is in dissolved form, and a chemical mechanical polishing (CMP) process using such CMP slurry. The present disclosure further provides an abrasive-free chemical mechanical polishing (CMP) slurry including a Lewis acid which is in dissolved form.
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