METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
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United States of America
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Jan 16, 2018
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Jan 16, 2018
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Abstract
A method for producing a ceramic circuit board including a ceramic substrate and a metal layer formed on the ceramic substrate, includes a step of forming the metal layer on the ceramic substrate by spraying a metal powder after accelerating the metal powder to a velocity of from 250 to 1050 m/s as well as heating the metal powder to from 10° C. to 270° C. and a step of subjecting the ceramic substrate and the metal layer to a heat treatment in an inert gas atmosphere.
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