THERMAL CONDUCTIVITY MEASUREMENT DEVICE AND THERMAL CONDUCTIVITY MEASUREMENT METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

SERIAL NO

16461594

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A thermal conductivity measurement device comprises: first and second clamping members which clamp an object; a heating member which has a contacting end surface which contacts a distal end surface of the first clamping member through a first axial correction member, and a distal end surface on the reverse side of the contacting end surface; a cooling member which has a contacting end surface which contacts a distal end surface of the second clamping member through a second axial correction member, and a distal end surface on the reverse side of the contacting end surface; a plurality of temperature sensors disposed on the clamping members; and a mechanism which applies a pressing force between the heating member and the cooling member. At least one surface of the first axial correction member and the second axial correction member has a convex curved shape, and the other surface is a flat surface.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONCHIYODA-KU TOKYO 100-8310

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakajima, Dai Chiyoda-ku, Tokyo, JP 41 470
Sanda, Yasuyuki Chiyoda-ku, Tokyo, JP 8 14
Tada, Haruna Chiyoda-ku, Tokyo, JP 5 5

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation