Fabrication Of Thin-Film Encapsulation Layer For Light Emitting Device

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United States of America

SERIAL NO

16546006

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Abstract

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An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

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Patent Owner(s)

Patent OwnerAddress
KATEEVA INC7015 GATEWAY BOULEVARD NEWARK CA 94560

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HARJEE, NAJID SUNNYVALE, US 1 2
VRONSKY, ELIYAHU LOS ALTOS, US 118 2116

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