ACOUSTIC WAVE DEVICE, HIGH FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE

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United States of America

SERIAL NO

16540143

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Abstract

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An acoustic wave device includes a supporting substrate, an acoustic reflection film the supporting substrate, a piezoelectric thin film on the acoustic reflection film, and an interdigital transducer electrode the piezoelectric thin film. The acoustic reflection film includes acoustic impedance layers including therein first, second, third, and fourth low acoustic impedance layers and first, second, and third high acoustic impedance layers. The acoustic reflection film includes a first acoustic impedance layer and a second acoustic impedance layer, the first and second acoustic impedance layers each being one of the acoustic impedance layers, and the second acoustic impedance layer has an arithmetic average roughness different from that of the first acoustic impedance layer.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDNAGAOKAKYO-SHI KYOTO 617-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kishimoto, Yutaka Nagaokakyo-shi, JP 55 3881
Okunaga, Hiromu Nagaokakyo-shi, JP 6 3
Omura, Masashi Nagaokakyo-shi, JP 41 166

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