SOLDERING SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND PROGRAM

Number of patents in Portfolio can not be more than 2000

United States of America

SERIAL NO

16476431

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitagawa, Nobuyasu Tokyo, JP 1 0
Kobayashi, Takashi Tokyo, JP 677 7609
Tamura, Masayoshi Tokyo, JP 13 58
Tanabe, Tsuyoshi Tokyo, JP 89 704

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