METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200006540A1
SERIAL NO

16448988

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Abstract

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The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

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Patent Owner(s)

Patent OwnerAddress
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS352 HENRY ADMINISTRATION BUILDING 506 SOUTH WRIGHT STREET URBANA IL 61801

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KHANG, Dahl-Young Seoul, KR 29 7391
LEE, Keon Jae Daejeon, KR 40 4841
MEITL, Matthew Durham, US 174 14449
MENARD, Etienne Voglans, FR 75 13198
NUZZO, Ralph G Champaign, US 37 6813
ROGERS, John A Wilmette, US 232 19828
SUN, Yugang Gladwyne, US 40 6992
ZHU, Zhengtao Rapid City, US 23 4805

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