POWDER FILM FORMING METHOD AND POWDER FILM FORMING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200009607A1
SERIAL NO

16482409

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Abstract

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A powder film forming method includes the steps of: filling an opening with a powder, the opening being formed in a screen plate; and forming the powder film by generating an electric potential difference between the screen plate and a substrate so as to cause the powder, which is filling the opening, to move to the substrate.

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Patent Owner(s)

Patent OwnerAddress
HITACHI ZOSEN CORPORATIONOSAKA-SHI OSAKA 559-8559

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUKUI, Hideyuki Osaka-shi, Osaka, JP 13 18
NISHIURA, Sousuke Osaka-shi, Osaka, JP 6 9
SUGIYO, Takeshi Osaka-shi, Osaka, JP 10 6

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