METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEATSINK
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United States of America
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Jan 9, 2020
app pub date -
Feb 28, 2018
filing date -
Feb 28, 2018
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Abstract
A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
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