HEAT PUMP APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200011569A1
SERIAL NO

16486874

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat pump apparatus includes a use-side heat exchanger that cause heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONCHIYODA-KU TOKYO 100-8310

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IPPOSHI, Shigetoshi Chiyoda-ku, JP 24 107
NOMURA, Yasumitsu Chiyoda-ku, JP 5 3

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