SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016623A1
SERIAL NO

16504473

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A substrate processing method according to an exemplary embodiment includes: supplying, to a peeling target portion which is at least a portion of a coating film including a first coating film and a second coating film, a chemical liquid for enhancing a peeling performance between the first coating film and the second coating film, the first coating film being formed on a surface of a substrate, the second coating film being formed on the first coating film and containing carbon with a different composition from that of the first coating film; amplifying a temperature fluctuation of the peeling target portion to which the chemical liquid has been supplied; and supplying a rinse liquid for removing the second coating film to the peeling target portion after the amplification of the temperature fluctuation.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • Owner owned or assignment not recorded

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nanba, Hiromitsu Kumamoto, JP 19 162

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation