ELECTRONIC COMPONENT MANUFACTURING METHOD AND APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016624A1
SERIAL NO

16503288

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic component manufacturing method includes a blotting process of bringing a conductive paste applied to an end portion of each electronic component body held by a jig into contact with a surface of a surface plate. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face of each electronic component body and the surface of the surface plate and a position changing process of changing a two-dimensional position where the end face of the electronic component body is projected on the surface of the surface plate in such a manner that the direction of the movement of two-dimensional position in parallel to the surface of the surface plate successively varies (e.g., along a circular path).

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Patent Owner(s)

  • CREATIVE COATINGS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKAMOTO, Hitoshi Nagaoka-shi, JP 142 954
SATO, Eiji Tokyo, JP 145 2490

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