DEVICE AND METHOD FOR REMOVING A LAYER FROM A SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016634A1
SERIAL NO

16582078

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Abstract

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At least one device (1) and at least one method for removing a layer (22) from a substrate (20) by applying a pulsed high voltage are disclosed. For this purpose, at least one pressure plasma burner (2) operating at atmospheric-pressure, a high-voltage source (3), and a supply of process gas (4) are required. Via a gas line (10), the supply of process gas (4) is connected with an inlet (6) of the plasma burner (2). The plasma burner (2) has a nozzle (7) through which a plasma jet (8) emerges. The high-voltage source (3) is configured such that a pulsed high voltage is applied between the plasma burner (2) and an electrically conductive element (11), which pulsed high voltage reaches a breakdown voltage in the region (29) of the conductive element (11).

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Seninck, Nathalie Dordives, FR 1 0

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