WIRE SAW, WIRE GUIDE ROLL AND METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF WAFERS FROM AN INGOT

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United States of America

APP PUB NO 20200016671A1
SERIAL NO

16483678

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Abstract

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A multiplicity of wafers are simultaneously cut from an ingot by means of a structured sawing wire, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire hears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

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Patent Owner(s)

  • SILTRONIC AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PIETSCH, Georg Burghausen, DE 25 171

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