METHOD FOR SLICING INGOT

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016719A1
SERIAL NO

16490737

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for slicing an ingot with a wire saw, comprising: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction of the wire; feeding an ingot held with a workpiece-feeding mechanism to the wire row for slicing; and slicing the ingot into a plurality of wafers, while supplying a slurry to a contact portion between the ingot and the wire, wherein a warp direction in a wire travelling direction of a wafer obtained in previous ingot slicing is checked in advance, and the ingot is then sliced under a condition that a warp direction in a workpiece feeding direction of a wafer to be obtained matches the checked warp direction in the wire travelling direction, so that the wafers have identical warp directions in the workpiece feeding direction and in the wire travelling direction.

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Patent Owner(s)

  • SHIN-ETSU HANDOTAI CO LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANBAYASHI, Keiichi Nishigo-mura, JP 4 0

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