Importance

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Abstract

A method for slicing an ingot with a wire saw, comprising: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction of the wire; feeding an ingot held with a workpiece-feeding mechanism to the wire row for slicing; and slicing the ingot into a plurality of wafers, while supplying a slurry to a contact portion between the ingot and the wire, wherein a warp direction in a wire travelling direction of a wafer obtained in previous ingot slicing is checked in advance, and the ingot is then sliced under a condition that a warp direction in a workpiece feeding direction of a wafer to be obtained matches the checked warp direction in the wire travelling direction, so that the wafers have identical warp directions in the workpiece feeding direction and in the wire travelling direction.

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First Claim