POLISHING APPARATUS AND POLISHING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016720A1
SERIAL NO

16507381

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A film thickness measuring apparatus and an end point detector monitor a film thickness of a conductive film based on an output of an eddy current sensor disposed in a polishing table. The output of the eddy current sensor includes an impedance component, and when a resistance component and a reactance component of the impedance component are associated with the respective axes of a coordinate system having two orthogonal coordinate axes, at least some points on the coordinate system corresponding to the impedance component form at least a part of a circle. The film thickness measuring apparatus determines a distance between a point on the coordinate system and the center of the circle, determines the film thickness from the impedance component and corrects the determined film thickness using the determined distance.

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Patent Owner(s)

  • EBARA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAMURA, Akira Tokyo, JP 269 2403

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