SLURRY AND POLISHING METHOD

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United States of America

APP PUB NO 20200016721A1
SERIAL NO

16334807

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Abstract

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A slurry comprises abrasive grains, a glycol, and water, wherein an average particle diameter of the abrasive grains is 120 nm or smaller, and a pH is 4.0 or higher and lower than 8.0. A polishing method comprises a step of polishing a metal by use of the slurry.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 105-8518

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OOUCHI, Mayumi Chiyoda-ku, Tokyo, JP 1 1

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