METHOD FOR SLICING WORKPIECE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200016791A1
SERIAL NO

16495632

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for slicing a workpiece with a wire saw which includes a wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface thereof around a plurality of grooved rollers, the wire being fed from one of a pair of wire reels and taken up by another, the method including feeding a workpiece to the row for slicing while allowing the wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in an axial direction of the workpiece simultaneously. Prior to slicing, an abrasive-grain abrading step wherein the wire is allowed to travel without slicing the workpiece, allowing the wire to rub against itself within the reels, and dressing its surface for 30 minutes or more. The method can dress a fixed abrasive grain wire at low cost and suppress thickness unevenness of wafers.

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Patent Owner(s)

  • SHIN-ETSU HANDOTAI CO LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TOYODA, Shiro Nishigo-mura, JP 2 0

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