WAFER DRYING SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200018549A1
SERIAL NO

16034526

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Abstract

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The present disclosure is directed to a wafer drying method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.

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  • Owner owned or assignment not recorded

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HSU, Wei-Chun Hsinchu, TW 34 86
WANG, Shu-Yen Taipei, TW 7 3
WU, Sheng-Wei Zhubei, TW 9 19

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