BOILING COOLING DEVICE AND BOILING COOLING SYSTEM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200018554A1
SERIAL NO

15781568

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A boiling cooling device and a boiling cooling system which can promote boiling and restrain the cooling capacity of the device from deteriorating. A boiling cooling device includes: a pump to circulate refrigerant; a microbubble generator to produce microbubbles and incorporate the microbubbles into the refrigerant discharged from the pump; a boiling cooler to which the refrigerant containing the microbubbles is supplied and which boils the refrigerant; a radiator to cool the refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump 11; and a gas-liquid separator 15 to separate gas from the circulating refrigerant after the refrigerant is boiled and before the refrigerant is taken in by the pump.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-8310

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASAI, Yugo Tokyo, JP 23 32
IPPOSHI, Shigetoshi Tokyo, JP 24 107
SHINOZAKI, Masaru Tokyo, JP 16 36

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation