WAFER DISTORTION MEASUREMENT AND OVERLAY CORRECTION
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United States of America
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Issued Date -
Jan 16, 2020
app pub date -
Jul 16, 2018
filing date -
Jul 16, 2018
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Abstract
A method includes measuring a topography of a semiconductor wafer. A distortion function is generated based on the measured topography. Measured alignment data associated with the semiconductor wafer is adjusted using the distortion function. At least one correction factor for an exposure tool is generated based on the adjusted alignment data. The exposure tool is configured based on the at least one correction factor.
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